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| CMS09 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS09 Switching Mode Power Supply Applications Portable Equipment Battery Applications * * * * Forward voltage: VFM = 0.45 V (max) Average forward current: IF (AV) = 1.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name) Unit: mm Maximum Ratings (Ta = 25C) Characteristics Repetitive peak reverse voltage Average forward current (Note) Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 1.0 (Ta = 51C) 25 (50 Hz) -40~150 -40~150 Unit V A A C C Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature JEDEC JEITA TOSHIBA 3-4E1A Note: Device mounted on a glass-epoxy board (board size: 50 mm 50 mm, soldering land: 6 mm 6 mm) Weight: 0.023 g (typ.) Electrical Characteristics (Ta = 25C) Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Junction capacitance IRRM IRRM Cj Test Condition IFM = 0.1 A IFM = 0.5 A IFM = 1.0 A VRRM = 5 V VRRM = 30 V VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (soldering land: 2 mm 2 mm) Thermal resistance Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm 6 mm) 3/4 Min 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 0.32 0.37 0.40 1.5 15.0 70 3/4 3/4 3/4 Max 3/4 3/4 0.45 3/4 500 3/4 60 C/W 135 16 C/W mA pF V Unit Thermal resistance Rth (j-) 1 2003-02-17 CMS09 Marking Following Indicates the Data of Manufacture Type code Lot No. Month of manufacture Year of manufacture January to December are denoted by letter A to L respectively. Last decimal digit of the year of manufacture 0 1 2 3 4 S9 5 6 7 8 9 Cathode mark Standard Soldering Pad Unit: mm 1.4 3.0 1.4 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2.1 2 2003-02-17 CMS09 iF - vF 10 0.6 Tj = 150C 125C PF (AV) - IF (AV) Average forward power dissipation PF (AV) (W) Rectangular waveform DC 0 a 360 Conduction angle: a a = 120 (A) Instantaneous forward current iF 0.5 0.4 a = 180 1 75C 25C 0.3 a = 60 0.2 0.1 0.1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) Ta max - IF (AV) Device mounted on a glass-epoxy board (board size: 50 mm 50 mm, land size 6 mm 6 mm) 160 140 120 100 a = 180 80 60 40 a = 60 20 0 0 0 a 360 IF (AV) Conduction angle: a VR = 15 V 0.6 0.8 1.0 1.2 1.4 1.6 a = 120 Rectangular waveform 160 Ta max - IF (AV) Device mounted on a ceramic board (board size: 50 mm 50 mm) Maximum allowable ambient temperature Ta max (C) Maximum allowable ambient temperature Ta max (C) 140 DC 120 100 a = 60 80 60 40 20 0 a 360 IF (AV) Conduction angle: a VR = 15 V 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Rectangular waveform a = 180 a = 120 DC 0.2 0.4 0 0 Average forward current IF (AV) (A) Average forward current IF (AV) (A) rth (j-a) - t (C/W) 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm 1.4 mm 100 Transient thermal impedance rth (j-a) Device mounted on a glass-epoxy board Soldering land: 6.0 mm 6.0 mm 10 Device mounted on a ceramic board Soldering land: 2.0 mm 2.0 mm 1 0.5 0.001 0.01 0.1 1 10 100 1000 Time t (s) 3 2003-02-17 CMS09 Surge forward current (non-repetitive) 28 Cj - VR 1000 (typ.) f = 1 MHz Ta = 25C (A) 24 20 16 12 8 4 0 1 Ta = 25C f = 50 Hz Peak surge forward current IFSM Junction capacitance 10 100 Cj 100 (pF) Number of cycles 10 1 10 100 Reverse voltage VR (V) I R - Tj 100 Pulse test (typ.) 0.8 PR (AV) - VR Rectangular waveform 0.7 0.6 VR 0.5 0.4 0.3 0.2 0.1 0 0 60 a 300 240 180 120 (typ.) Reverse current IR (mA) 10 VR = 30 V Average reverse power dissipation PR (AV) (W) 0 360 DC 1 VR = 20 V VR = 15 V Conduction angle: a Tj = 150C 0.1 VR = 3 V 0.01 VR = 10 V VR = 5 V 0.001 0 20 40 60 80 100 120 140 160 10 20 30 Junction temperature Tj (C) Reverse voltage VR (V) 4 2003-02-17 CMS09 RESTRICTIONS ON PRODUCT USE 000707EAA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 5 2003-02-17 |
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